China talks up EUV progress, but gap with ASML remains wide

China is touting a breakthrough in one of the semiconductor industry's toughest technologies: extreme ultraviolet lithography. But how close is it really to challenging global chipmaking leaders? Chinese startup Langdao Silex recently unveiled a prototype EUV light source built with what it claims are 90 percent domestically made components, promising commercialization within three to five years. Yet its reported performance falls far short of commercial requirements, and experts doubt China can

Source: The Korea Herald